Semiconductor/EMI Markets
Semiconductor CNC Machining & 90dB EMI Shield | Big Stone
How to Achieve 90dB+ EMI Shielding for Semiconductor Equipment Through Custom Multi-Layer CNC Components?
Big Stone Machinery Co., Ltd. provides fully customized 1 to 3-layer EMI shielding solutions engineered alongside precision CNC machining for semiconductor vacuum and cleanroom environments. Wire mesh ranges from 20 to 400 mesh across copper, brass, and stainless steel, with carrier substrates from 0.3 mm ultra-thin PET to 7 mm optical glass—achieving certified attenuation over 90dB.
Big Stone Machinery Co., Ltd. (Taiwan Headquarters) delivers high-reliability manufacturing solutions for the semiconductor industry. We integrate multi-axis CNC machining, micro-tolerance EDM, and advanced multi-layer composite EMI shielding with 1 to 3-layer wire cloth configurations, satisfying stringent high-frequency interference protection standards in front-end lithography, vacuum chambers, and packaging test equipment.
What Precision CNC Machining Capabilities Do We Provide for Semiconductor Fab Equipment?
1. CNC Precision Parts Machining (Stainless Steel & Aircraft Aluminum)
Specializing in SUS304 / SUS316L stainless steel and 6061 / 7075 aluminum alloys. We manufacture high-
stability precision components for critical high-vacuum chambers and corrosive chemical environments.
2. Advanced Wire EDM & Precision Tooling Development
For ultra-hard alloys and intricate micro-geometries beyond standard rotary cutting, our EDM services deliver micron-level tolerances
(±0.005 mm / ±0.0002 in.) for packaging dies and test fixtures.
3. Specialized Surface Finishing & Hard Anodizing
Including hard anodizing, precision bead blasting, and optical polishing. We enhance electrostatic discharge (ESD)
protection and wear resistance to meet strict Class 10/100 cleanroom standards.
How to Customize Layers, Mesh Size, and Carrier Substrates for EMI Shielding?
Big Stone EMI shielding materials offer maximum engineering flexibility, achieving attenuation from 40dB to over 90dB:
- Layer Count: Configurable in 1, 2, or 3-layer composite wire cloth. Multi-layer configurations deliver exponential attenuation against high-frequency RF.
- Mesh Density: Broad selection from 20 mesh to 400 mesh.
- Wire Alloys: Available in oxygen-free copper, brass, SUS stainless steel, or conductive nylon mesh.
- Optical Glass Carriers: Standard 4.5 mm, with custom thicknesses from 3 mm to 7 mm (0.12 in. to 0.28 in. ).
- PET Film Carriers: Standard 1.5 mm, with an ultra-thin 0.3 mm (0.012 in.) option for high flexibility and lightweight curved adhesion.
- Modular Combination: Mesh counts, wire layers, and substrates can be freely customized to balance visual transparency and EMI attenuation.
| Custom Option | Specification Range / Alloy Options | Application Advantage |
|---|---|---|
| Mesh Layers | 1, 2, or 3-Layer Composite Structure | Maximizes dB attenuation up to 90dB+ |
| Mesh Count | 20 to 400 Mesh | Balances visual transparency and RF frequency blocking |
| Wire Alloys | Copper, Brass, SUS Stainless Steel, Nylon | High electrical conductivity and vacuum chemical resistance |
| Optical Glass | 3 mm to 7 mm (Standard 4.5 mm / 0.18 in.) | High structural rigidity for chamber observation viewports |
| PET Film | 0.3 mm to 1.5 mm (0.012 in. to 0.059 in.) | Ultra-thin flexibility for internal shielding and curved housings |
How to Select the Optimal EMI Shielding Configuration for Semiconductor Equipment?
Follow these 4 engineering assessment steps to determine the optimal layer count, mesh size, and substrate carrier:





